Manufacturing Process

1. PTFE Material Processing
We use a stepwise temperature ramping curve (peak temperature 280±5°C) and vacuum hot pressing process (pressure 30-50 kg/cm²) to effectively control PTFE phase transitions and ensure lamination quality.

2. Ceramic Substrate Processing
For aluminum oxide (Al₂O₃) and aluminum nitride (AlN) substrates, we employ laser direct writing technology to achieve 50μm line width precision, meeting high-density interconnect requirements.

3. Hybrid Pressing Technology
For PTFE and FR-4 hybrid designs, we use specialized adhesive sheets such as RO4450B and optimize pressing parameters to address mismatched thermal expansion coefficients (CTE) between different materials.